✨ New Arrivals Just Dropped!Explore
Amaoe BGA Stencil for Apple iPhone 6 - 15 Series, CPU / Baseband / IC
Amaoe BGA Stencil for
Apple iPhone 6 - 15 Series
Amaoe BGA Stencil BB:1 is designed for high-precision repairs on Apple iPhone 6 to iPhone 15 devices, being an essential tool
for professional technicians. With an ultra-thin 0.12mm design, it fits perfectly on the chip surface,
increasing the success rate of reballing and ensuring optimal performance in soldering processes. Made from superior quality stainless steel,
the stencil withstands high temperatures and corrosion, maintaining its stable shape without deforming, even after repeated use.
Micron-level laser cutting technology guarantees precise alignment of solder balls, reducing soldering errors and improving
overall yield. Compatible with CPUs, basebands, power management ICs, and other Apple chips,
it offers an efficient solution for both individual repair shops and mass production.
Features:
- Ultra-thin 0.12mm design for precise fit and successful reballing
- Made of heat and corrosion-resistant stainless steel
- High-precision laser cutting for uniform alignment and correct soldering
- Compatible with a wide range of Apple chips (CPU, baseband, power ICs)
- Fast and easy operation, significantly reducing the reject rate
- Durable and reusable hundreds of times, easy to clean and highly cost-effective
$2.24
Original: $6.40
-65%Amaoe BGA Stencil for Apple iPhone 6 - 15 Series, CPU / Baseband / IC—
$6.40
$2.24Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Amaoe BGA Stencil for
Apple iPhone 6 - 15 Series
Amaoe BGA Stencil BB:1 is designed for high-precision repairs on Apple iPhone 6 to iPhone 15 devices, being an essential tool
for professional technicians. With an ultra-thin 0.12mm design, it fits perfectly on the chip surface,
increasing the success rate of reballing and ensuring optimal performance in soldering processes. Made from superior quality stainless steel,
the stencil withstands high temperatures and corrosion, maintaining its stable shape without deforming, even after repeated use.
Micron-level laser cutting technology guarantees precise alignment of solder balls, reducing soldering errors and improving
overall yield. Compatible with CPUs, basebands, power management ICs, and other Apple chips,
it offers an efficient solution for both individual repair shops and mass production.
Features:
- Ultra-thin 0.12mm design for precise fit and successful reballing
- Made of heat and corrosion-resistant stainless steel
- High-precision laser cutting for uniform alignment and correct soldering
- Compatible with a wide range of Apple chips (CPU, baseband, power ICs)
- Fast and easy operation, significantly reducing the reject rate
- Durable and reusable hundreds of times, easy to clean and highly cost-effective
